- Location: Engineering East A010
- Maximum accelerating voltage - 200 kV
- Total beam current - >50 nA
- STEM magnification range - 150× - 230 M×
- TEM magnification range - 25× - 1.5 Mx
- Probe current (at 200kV) - 0.4 nA (0.31 nm probe)
1.5 nA (1.0 nm probe) - Piezo stage
- Full remote operation with automatic aperture system in combination with the Ceta camera
Find out more about the FEI Talos F200X TEM
The Thermo Scientific Talos F200X scanning/transmission electron microscope (S/TEM) combines outstanding high-resolution STEM and TEM imaging with industry-leading energy dispersive x-ray spectroscopy (EDS) signal detection and 3D chemical characterization with compositional mapping. The Talos F200X includes Super-X EDS system with four silicon drift detectors (SDDs) for superior sensitivity and mapping capabilities of up to 105 spectra/sec. Integration with the A-TWIN objective lens maximizes collection efficiency while delivering outstanding output count rates for a given beam current even for low intensity EDS signals. The X-FEG high brightness electron source delivers high total current up to five times the beam current of a standard Schottky FEG while keeping the convergence angle small. You gain improved signal-to-noise ratio and exceptional image resolution for STEM, EDS, and high resolution TEM applications. Stability and a long lifecycle enable the FEI X-FEG to deliver superior imaging efficiency. The Ceta 16M camera displays a large field of view and captures images at a fast rate of 25 fps, while the piezo stage ensures high sensitivity, drift-free imaging and precise sample navigation, saving time and allowing you to capture more data from each sample. It’s also equipped with a Gatan Enfinium 976 EELS for chemical and compositional analysis.
Sample Requirements:
Nanomaterials (e.g. nanoparticles, nanowires) are simply dispersed onto 3 mm diameter TEM grids (e.g. carbon coated Cu grid) by drop-cast with suitable solvents and air/vacuum-dried.
Bulk materials can be prepared, for example, by extracting micro-scale sections from the material by FIB (Focussed Ion Beam) or by punching discs out of sheet materials.
Metal materials are required to be prepared as 3 mm diameter discs with a thickness less than 50 micron and thinned-hole edges that are electron transparent (this involves several cutting and machining techniques, e.g. grinding, polishing, jet-electropolishing, PIPS).
Image Courtesy of Thermo-Scientific