Extending understanding of electrostatic chuck operation to improve wafer processing
The SPTS division of KLA provides advanced wafer processing solutions to the world’s leading semiconductor and microelectronic device manufacturers. Increasing demand for semiconductor devices is driving demand for wafer processing equipment. End market applications for KLA's wafer processing equipment include microelectromechanical systems (MEMS), advanced packaging, photonics, high speed RF IC’s, and power semiconductors.
The electrostatic chuck (ESC) is a key component in vacuum-based wafer processing equipment. In addition to its supply within the equipment, there is also a growing demand for replacement ESCs from the aftersales market. To maintain supply of high quality ESCs, an in-depth understanding of their operational characteristics and possible failure modes is required.
The Electrostatic Chuck (ESC) is comprised of upper ceramic layers positioned on a metal body. Electrodes are attached to the ceramic to generate the charge. RTV silicone between the layers provides good thermal contact and compensates for differences in thermal expansion.